Swin-SEMI100/150/200/300型半自动测试探针台
Swin-SEMI100MC/150MC/200MC/300MC型半自动测试探针台(注:带有微型封闭式腔室)
应用:
主要应用在半导体/微电子,电子,机电,物理,化学,材料,光电,纳米,微机电/MEMS,生物芯片,航空航天等科学研究领域,以及IC设计/制造/测试/封装、LED、LCD/OLED、LD/PD、PCB、FPC等生产制造领域;在各大高校、研究所及半导体行业应用较广。
技术参数:
SEMI100/150/200/300型
SEMI100MC/150MC/200MC/300MC型
测试样品尺寸:
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4”、6”、8”、12”
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Chuck X-Y Stage
样品卡盘XY轴
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* Travel(行程) : 100mm x 100mm(4寸)
150mm x 150mm(6寸)
200mm x 200mm(8寸)
300mm x 300mm(12寸)
* Speed(速度):50mm/sec (max)
* Resolution(分辨率):0.5 μm
* Accuracy(精度):±2 μm
* Repeatability(重复精度):< 3 μm
* Movement(运动):Motorized(机械)
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Chuck Z Stage
样品卡盘Z轴
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* Travel(行程):10mm
* Speed(速度):20mm/sec (max)
* Resolution(分辨率):1.25 μm
* Accuracy(精度):±2 μm
* Repeatability(重复精度):< 3 μm
* Movement(运动):Motorized(机械)
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Chuck Theta
样品卡盘θ轴
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* Travel(行程):±10 deg
* Resolution(分辨率):0.0018 deg
* Movement(运动):Motorized(机械)
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Platen
台板
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* Travel(行程):10mm
* Resolution(分辨率):5um
* Movement(运动):Manual(手动)
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Microscope Stage
显微镜平台
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* X-Y travel(行程):50mm x 50mm
* Z (行程) :50mm
* Movement(运动):Manual(手动)
(Motorize option 机械式可选)
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Control Software
控制软件
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* Remote control chuck X,Y,Z, Theta(XYZ控制)
* Wafer Mapping(晶圆MAP图)
* Auto alignment 自动校正(pattern recognition模式识别)
* Library to pilot measurement instrument
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Manual Adjustable
手动可调
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*Chuck stage travel X,Y(样品载台行程): 100mm
*Manual chuck theta adjustment(手动卡盘θ调整)
*Chuck up-down(卡盘上下可调):5mm
*Microscope stage travel X,Y(显微镜台行程): 25mm
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option
可加选项:
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*Gold Plating Chuck 100mm(镀金)
*Gold Plating Chuck 150mm(镀金)
*Gold Plating Chuck 200mm(镀金)
*Gold Plating Chuck 300mm(镀金)
*Triaxial chuck (三轴环境卡盘)
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